Power chips are linked to external circuits via packaging, and their efficiency depends upon the assistance of the packaging. In high-power scenarios, power chips are typically packaged as power modules. Chip interconnection describes the electric connection on the top surface area of the chip, which is generally aluminum bonding cord in traditional modules. ^
Typical power component package cross-section
Today, business silicon carbide power modules still primarily make use of the packaging innovation of this wire-bonded traditional silicon IGBT component. They face issues such as huge high-frequency parasitic criteria, inadequate warm dissipation ability, low-temperature resistance, and not enough insulation toughness, which limit using silicon carbide semiconductors. The display of superb performance. In order to resolve these problems and fully exploit the huge possible advantages of silicon carbide chips, many new packaging modern technologies and remedies for silicon carbide power modules have arised recently.
Silicon carbide power module bonding approach
(Figure (a) Wire bonding and (b) Cu Clip power module structure diagram (left) copper wire and (right) copper strip connection process)
Bonding materials have developed from gold wire bonding in 2001 to light weight aluminum wire (tape) bonding in 2006, copper cord bonding in 2011, and Cu Clip bonding in 2016. Low-power devices have actually established from gold wires to copper wires, and the driving pressure is cost reduction; high-power tools have established from aluminum cords (strips) to Cu Clips, and the driving force is to boost product efficiency. The higher the power, the greater the needs.
Cu Clip is copper strip, copper sheet. Clip Bond, or strip bonding, is a packaging procedure that uses a strong copper bridge soldered to solder to attach chips and pins. Compared to standard bonding packaging approaches, Cu Clip modern technology has the complying with benefits:
1. The link between the chip and the pins is made of copper sheets, which, to a specific level, replaces the standard wire bonding approach between the chip and the pins. As a result, a distinct plan resistance value, higher present flow, and much better thermal conductivity can be acquired.
2. The lead pin welding location does not require to be silver-plated, which can completely conserve the expense of silver plating and inadequate silver plating.
3. The product look is totally regular with regular items and is mostly used in web servers, portable computer systems, batteries/drives, graphics cards, electric motors, power materials, and various other fields.
Cu Clip has 2 bonding approaches.
All copper sheet bonding method
Both eviction pad and the Source pad are clip-based. This bonding technique is more costly and complex, but it can attain much better Rdson and far better thermal effects.
( copper strip)
Copper sheet plus cord bonding approach
The resource pad utilizes a Clip technique, and the Gate utilizes a Cord method. This bonding approach is slightly less expensive than the all-copper bonding approach, conserving wafer area (appropriate to very tiny entrance areas). The process is less complex than the all-copper bonding technique and can obtain much better Rdson and better thermal result.
Supplier of Copper Strip
TRUNNANOÂ is a supplier of surfactant with over 12 years experience in nano-building energy conservation and nanotechnology development. It accepts payment via Credit Card, T/T, West Union and Paypal. Trunnano will ship the goods to customers overseas through FedEx, DHL, by air, or by sea. If you are finding tinned copper wire, please feel free to contact us and send an inquiry.
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